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VT-X750

High-speed automated X-ray CT inspection system

VT-X750

In-line Full Inspection System

Hardware configuration / Function

Item Description
Model VT-X750 VT-X750-XL
Type H-FR FR H-FR
Inspection object BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side
terminal components, QFN, Power devices, POP, Press-fit CN, etc.
Inspection items Void, open, non-wet, Solder Volume, shifting, foreign object, bridging,
Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications)
Imaging
system
Method 3D-slice imaging by using parallel CT
Resolution 6,8,10,15,20,25,30µm/pixel
(selectable in the
inspection program)
3, 6,8,10,15,20,25,30µm/pixel
(selectable in the
inspection program)
10,15,20,25,30µm/pixel
(selectable in the
inspection program)
X-ray source Micro-fucus closed tube
X-ray detector Flat panel detector
PCBA Size 50x50~610x515mm (2x2 to 24x20 inch),
Thickness:0.4~5.0mm (0.4~3.0mm in 3µm resolution)
100x50~1200x610mm,
Thickness:0.4~15.0mm
Weight Less than 4.0 kg (with component mounted) Less than 15kg
Component
clearance
Top:Less than 40 mm,
Bottom:less than 39 mm
Top: Less than 40 mm,
Bottom: Less than 40 mm
Warpage Less than 2.0 mm
(Less than 1.0mm in 3µm resolution)
Less than 3.0 mm
Main
body
Footprint 1,550(W) x 1,925(D) x 1,645(H) mm 2,180(W)×2,510(D)×1,735(H)mm
Weight Approx. 3,100kg Approx. 5,350kg
Conveyor
height
900 ±20 mm
Power supply Single phase, 200 to 240 VAC, 50/60 Hz
Rated power 2.4kVA 2.58kVA
X-ray leakage Less than 0.5 µSv/h
Air supply 0.4 to 0.6 Mpa
Safety
standard
CE, SEMI, NFPA, FDA CE, SEMI, NFPA, FDA
*Under Acquiring